Lite-On Storage Unveils TSV 3D NAND Plans at Flash Memory Summit 2017
TSV Technology Could Improve SSD Power and Performance by 20 to 30 Percent
Santa Clara, Calif., August 8, 2017 - Lite-On Storage, an established leader in the rapidly expanding solid-state drive (SSD) industry, said today it will utilize the power and performance benefits of Toshiba Memory Corp.'s TSV (Through Silicon Via) technology in future drives.
Speaking at the Flash Memory Summit 2017 (FMS) here, company executives said they expect to be one of the first vendors to offer TSV 3D NAND SSDs as early as this year.
"It's not surprising to see a market leader such as Lite-On Storage implementing TSV NAND as it offers the ability to design drives with higher density and performance while consuming less power," said Greg Wong, Principal Analyst at Forward Insights. "We expect the performance-per-Watt benefits to drive industry adoption of TSV NAND for solid-state storage in the coming year."
"Lite-On spends considerable time investing in innovations that enhance the experience customers have with our drives, and TSV looks particularly promising to us right now," said Andy Hsu, Senior Director, SSD R&D Center, Lite-On Storage Group. "We've been assessing it for several months, and early indications are this technology could be a game changer in the SSD industry."
According to Hsu, company engineers tested Lite-On SSDs containing Toshiba Memory Corp.'s BiCS FLASH™ 3D TLC flash memory chips and TSV technology against comparable systems. Results showed 3D NAND SSDs with TSV technology used 20 percent less power and performed up to 30 percent better.
"Enterprise organizations with hundreds or thousands of SSDs should be excited by this because it could mean significant savings on the total cost of ownership (TCO)," said Darlo Perez, Managing Director, Americas Region at Lite-On Storage Group. "Because these systems perform so well, you can reduce the number of deployments as well as the footprint occupied by those deployments. In addition, since they use less power, you save money on energy bills while contributing to a more sustainable future."
TSV works by using vertical electrodes and vias to pass through silicon dies and make a connection. The result is high speed data input and output and reduced power consumption.
Toshiba Memory Corp. recently introduced its first BiCS FLASH™ 3D TLC NAND flash chips with 512 GB and 1 TB capacities. The new ICs stack 8 or 16 3D NAND devices, which use TSV, are among the highest capacity non-volatile memory stacks available in the industry.
"As Toshiba Memory Corp. continues delivering powerful NAND flash chips built around TSV, it is exciting to see leading SSD vendors, such as Lite-On Storage, embracing this innovative technology," said Hiroo Ohta, Technology Executive at Toshiba Memory Corp. "We look forward to supporting Lite-On in its work to re-define SSD architecture."
FMS attendees are encouraged to stop by Lite-On Booth #621 at the Santa Clara Convention Center for a demonstration of the next generation EP Series with TSV technology.
In addition, Benjamin Chang, a project manager with Lite-On Storage, will describe the company's lab findings and plans for TSV technology during a speech at FMS on Tuesday, Aug. 8 at 5:55 pm at the FMS Theatre
A Strategic Business Group of Lite-On Technology Corporation, Lite-On Storage is a global leader in the design, development and manufacturing of Solid-State Drives (SSDs) for PC Client, Industrial Solutions, Automotive, Enterprise and Cloud Computing.
Available in a variety of interfaces and form factors to deliver the right product for the right application, Lite-On SSD solutions are highly customizable using industry-leading key components. Designed for innovation, built for quality, and chosen for performance, all Lite-On SSDs are 100% manufactured in-house utilizing state-of-the art facilities in Taiwan, and 100% aging tested, making Lite-On SSD one of the world's top 3 SSD suppliers. Additional information about Lite-On can be found at: liteonssd.com